MediaTek Expands High-End Mobile Chipset Lineup with New Dimensity 9400e Processor for Premium Smartphones.
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MediaTek has broadened its high-end mobile chipset offerings with the introduction of the Dimensity 9400e processor, designed for premium smartphones. Unveiled on May 14, 2025, this new chipset aims to deliver flagship-class experiences to a wider range of devices.

Architecture and Performance

The Dimensity 9400e is built on TSMC's third-generation 4nm process. It features an "All Big Core" CPU architecture, which includes one Arm Cortex-X4 core clocked at 3.4GHz, three Arm Cortex-X4 cores at 2.85GHz, and four Cortex-A720 cores at 2.0GHz. Complementing this setup is an 8MB L3 cache and a 10MB SLC. For graphics, the chipset integrates a 12-core Immortalis-G720 MC12 GPU with hardware-level ray tracing support, enhancing the visual experience for gaming and other graphically intensive applications. The Dimensity 9400e is equipped with MediaTek's APU 790, enabling generative AI features on smartphones. The new chipset supports LPDDR5X memory up to 8533MHz and UFS 4.0 storage.

MediaTek's HyperEngine and Adaptive Gaming Technology are incorporated in the Dimensity 9400e to boost gaming performance while reducing power consumption. A new Frame Rate Converter is also included, which MediaTek claims can reduce power consumption by 40% when enabled.

Connectivity and AI

The Dimensity 9400e supports advanced connectivity features, including Wi-Fi 7 with a peak data rate of 7.3Gbps. It also features Bluetooth 6.0 with a dual Bluetooth engine, which MediaTek claims can provide a connection range of up to 5km within line of sight. The chipset supports 5G sub-6GHz with AI-Modem Enhancement and can reach downlink speeds of up to 7Gbps exclusively from sub-6GHz networks. It also supports multi-mode Dual SIM Dual Active technology and MediaTek 5G UltraSave 3.0 for power efficiency.

The Dimensity 9400e supports the latest MediaTek NeuroPilot SDK, enabling modern AI technologies, including support for Multi-Modality (LMM), Large Vision Models (LVM), and additional Language Models (SLM/LLM) from the global AI ecosystem. It also supports on-device processing for large language models like DeepSeek-R1-Distill, Gemini Nano, and LLaVA-1.5 7B.

Camera and Other Features

Smartphones powered by the Dimensity 9400e can support up to a 320-megapixel rear camera and video recording at up to 8K/30fps or 4K/60fps. The chipset includes an 18-bit RAW ISP and supports AI semantic segmentation video engines capable of 16-layer image semantic segmentation, as well as high-dynamic noise reduction for recordings with three microphones.

Availability

The Dimensity 9400e is expected to appear in smartphones in the coming weeks. Realme and OnePlus have announced their support for the chipset, with the Realme GT 7 and the OnePlus Ace 5 Racing Edition (China only) set to be among the first devices to feature it. The Realme GT 7 is scheduled to launch globally, including in India, on May 27.

Competition

The MediaTek Dimensity 9400e is positioned to compete with chipsets like the Qualcomm Snapdragon 8s Gen 4. While it is a step down from the flagship Dimensity 9400, it aims to bring top-tier power and AI capabilities to more affordable phones.


Writer - Rahul Verma
Rahul has a knack for crafting engaging and informative content that resonates with both technical experts and general audiences. His writing is characterized by its clarity, accuracy, and insightful analysis, making him a trusted voice in the ever-evolving tech landscape. He is adept at translating intricate technical details into accessible narratives, empowering readers to stay informed and ahead of the curve.
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